M2DC showcasing its High-Performance Carrier Blade at the Embedded World 2019
Feb. 28, 2019, 9:31 a.m.
Contributors: Micha vor dem Berge, Jens Hagemeyer, Joao Costa
The M2DC team was part of the 2019’s edition of the leading international fair for embedded systems - Embedded World - taking place in Nuremberg, Germany, during 26-28 February. It aimed to showcase some of the most exciting innovations from the embedded domain, and covered a wide range of scientific topics, ranging from construction elements through modules and full systems, operating systems, or hard and software to services. This major European event included more than 1,000 exhibitors and numerous speakers from 52 countries, with more than 32,000 trade visitors and approximately 2,200 conference participants from 77 countries.
Once again, the M2DC team took the opportunity to be present at this excellent event, and to interact with the domain experts and potential new customers. It was presenting its technology on the Congatec booth, Hall 1 / 1-358. Congatec is particularly important for the outreach of M2DC, being a manufacturer of High-Performance Microservers. Our team showcased the "High-Performance Carrier Blade", which can host up to three high-performance x86/FPGA/ARM microservers. This blade features multiple 10 Gbit Ethernet connections per microserver, and an onboard 10/40 Gbit Ethernet switch. Additionally, the PCIe based switching can be used for high-speed low-latency communication between microservers or PCIe extension cards. The typical use cases discussed with the visitors included machine learning, big data, cloud computing, and computer vision. If you did not have opportunity to visit us at the Embedded World 2019, contact us directly or learn more about our technology at the M2DC product page, and follow us at our social channels.