It is our great pleasure to be able to share photos of some of the building blocks of the heterogeneous M2DC platform – the heterogeneous M2DC server system with integrated microservers and hardware accelerators; CPUs (x86, ARM32, ARM64), integrated CPUs/GPUs (NVIDIA TX1/TX2) and FPGAs.

With a blade-style design, the platform integrates up to 144 low-power microservers or 27 high-performance microservers in a single 3HE chassis. Microservers are based on established Computer on Module standards (COM Express, Nvidia Jetson, Toradex Apalis) with novel microservers developed for M2DC including the ARM64 Microserver and the Intel Stratix 10 Microserver.

ARM64 Microserver Key Specifications:

• COM Express Type 7 form factor

• 32 Core Cortex-A72 @ 2.1 GHz

  • 48 kByte L1 I-Cache, 32 kByte L1 D-Cache per Core

  • 8 MByte L2 Cache

  • 32 MByte L3 Cache

• 4x DDR4 ECC SO-DIMM (up to 128 GByte, quad channel)

• 4x 10GBASE-KR, 1000BASE-T, 2x SAS, USB

• 3x PCIe 3.0 x8

• Onboard SD card and eMMC flash

• Support Multi-Socket configurations

Intel Stratix 10 (FPGA) Microserver Key Specifications:

• COM Express Type 7 form factor

• High-density FPGA fabric, 2800 logic elements

• Quad-core Cortex-A53 @ 1.5 GHz

• On board 56 GByte DDR4 + ECC (quad channel)

• 4x 10GBASE-KR, 1000BASE-T, 2xSAS, USB, SDI/DP

• 4x PCIe 3.0 x16

• Onboard eMMC flash

M2DC PLATFORM |  The server chassis will fit the microservers developed within M2DC as well as different types of microservers available on the market, and provide a flexible, high-speed, low-latency communication infrastructure between then.

You are invited to see the new M2DC platform at the following events in 2018:

• HiPEAC CSW Spring 2018, Gothenburg - Sweden, May 22-24, 2018

• E2DC Workshop, Karlsruhe - Germany, June 12, 2018

• Forum Teratec, Paris - France, June 19-20, 2018

• ISC 2018, Frankfurt - Germany, June 24-28, 2018

• SC 2018, Dallas - US, November 11-16, 2018