The 2019’s edition of the the leading international fair for embedded systems - Embedded World - will be taking place in Nuremberg, Germany, between 26 and 28 of February. It will be unveiling some of the most exciting innovations from the embedded domain, with more than 1,000 exhibitors and numerous speakers from 52 countries, more than 32,000 trade visitors and approximately 2,200 conference participants from 77 countries. This event will be covering a wide range of topics, ranging from construction elements through modules and full systems, operating systems, or hard and software to services.

The M2DC team will once again be part of this excellent event to interact with the domain experts and potential new customers, presenting on the Congatec booth, Hall 1 / 1-358. In particular, we will be showcasing the "High-Performance Carrier Blade" which can host up to three high-performance x86/FPGA/ARM microservers. It features multiple 10 Gbit Ethernet connections per microserver and an on-board 10/40 Gbit Ethernet switch. Additionally, the PCIe based switching can be used for high-speed low-latency communication between microservers or PCIe extension cards. The typical use cases include machine learning, big data, cloud computing, and computer vision. Meet us at the Embedded World, learn more about our technology at the M2DC product page, and follow us in our social channels.

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